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New Printed Circuits And Boards Standards for the 2nd Quarter 2015

Kyle Bach

Document Center Inc. is pleased to announce that the following New Standards on Printed Circuits And Boards are now available:


  • BS EN 61189-2-721, 2015 Edition, Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
  • BS EN 61189-5-2, 2015 Edition with Corrigendum, Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies
  • BS EN 61189-5-3, 2015 Edition with Corrigendum, Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
  • BS EN 61189-5-4, 2015 Edition with Corrigendum, Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies 
  • IEC 60194, Edition 6.0, Printed board design, manufacture and assembly – Terms and definitions
  • IEC 61189-2-721, Edition 1.0, Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
  • IEC 62878-1-1, Edition 1.0, Device embedded substrate – Part 1-1: Generic specification – Test methods
  • IEC 62878-2-1, Edition 1.0, Device embedded substrate – Part 2-1: Guidelines – General description of technology
  • IEC 62878-2-3, Edition 1.0, Device embedded substrate – Part 2-3: Guidelines – Design guide
  • IEC 62878-2-4, Edition 1.0, Device embedded substrate – Part 2-4: Guidelines – Test element groups (TEG)
  • IPC 7801, 1st Release, Reflow Oven Process Control Standard
  • IPC DRM-PTH, Revision F, Through Hole Solder Joint Evaluation Training and Reference Guide
  • IPC DRM-SMT, Revision F, Surface Mount Solder Joint Evaluation Training and Reference Guide
  • IPC T 50, Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits


For more standards like these, please see our Document Center List of Standards on Printed Circuits And Boards.