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New Semiconductor Standards for the 1st Half of 2014

Kyle Bach

Document Center Inc. is pleased to announce that the following New Standards on Semiconductor Devices are now available:


  • BS EN 60191-4, 2014 Edition, Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
  • BS EN 60749-26, 2014 Edition, Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
  • IEC 62047-20, Edition 1.0, Semiconductor devices – Micro-electromechanical devices – Part 20: Gyroscopes
  • IEC 62047-21, Edition 1.0, Semiconductor devices – Micro-electromechanical devices – Part 21: Test method for Poisson’s ratio of thin film MEMS materials
  • IEC 62047-22, Edition 1.0, Semiconductor devices – Micro-electromechanical devices – Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
  • IEC 62483, Edition 1.0, Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices


For more standards on this topic, please see our Document Center List of Standards on Semiconductor Devices.  Not only are there more documents for you to review, there’s also links to lists on additional subsets on this subject.

You’ll also want to review my previous blog:

And if you’re interested, read my review of the JEP 172 at StandardsForum.com: