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New Electronics Standards for the 1st Quarter 2014

Kyle Bach

Document Center Inc. is pleased to announce that the following New Standards on Electronics are now available:


  • BS 6221-25, Withdrawn without replacement, Printed wiring boards. Guide to the rework and repair of soldered surface mounted printed board assemblies
  • BS EN 61249-4-18, 2013 Edition, Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  • BS EN 61249-4-19, 2013 Edition, Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  • BS QC 200012, Withdrawn without replacement, Process assessment schedule for printed board design facilities
  • IEC 60050-114, Edition 1.0, International electrotechnical vocabulary – Part 114: Electrochemistry
  • IEC 61190-1-2, Edition 3.0, Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
  • IEC 61837-2 Amendment 1, Amendment 1 for Edition 2.0, Surface mounted piezoelectric devices for frequency control and selection – Standard outlines and terminal lead connections – Part 2: Ceramic enclosures
  • IEC 61967-8, Edition 1.0, Integrated circuits – Measurement of electromagnetic emissions – Part 8: Measurement of radiated emissions – IC stripline method
  • IEC 62629-12-1, Edition 1.0, 3D Display devices – Part 12-1: Measuring methods for stereoscopic displays using glasses – Optical
  • IEC 62647-3, Edition 1.0, Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 3: Performance testing for systems containing lead-free solder and finishes (Replaces IEC/PAS 62647-3)
  • IEC 62715-6-1, Edition 1.0, Flexible display devices – Part 6-1: Mechanical stress test methods
  • IEC 62761, Edition 1.0, Guidelines for the measurement method of nonlinearity for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF)
  • IPC 4101, Revision D, Specification for Base Materials for Rigid and Multilayer Printed Boards
  • J-STD-030, Revision A, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
  • MIL-STD-883, Revision J with Change Notice 3, Test Method Standard – Microcircuits


For similar standards, please  follow the links on our page Document Center List of Standards on Electronics.

You’ll also want to review this quarter’s blog:

And if you’d like to see smiliar U.S. Military documents, please see our Document Center List for FSC 5962, Microcircuits.